PM on E2 extended by 4 hours due to gasket failure; root cause: gasket aged beyond 2-year service life; recovery action: replaced gasket and pressure-tested.
PM on LITHO-07 extended by 8 hours due to chuck encoder misalignment; root cause: thermal expansion mismatch; recovery action: realigned and verified with monitor lot.
weekly OEE report
OEE on module this week: N%; vs target target%; gap driven by factor.
OEE on the etch cluster this week: 78%; vs target 85%; gap driven by three unscheduled CMs on chamber A.
OEE on the litho module this week: 90%; vs target 85%; gap closed after PM optimization.
leak check report
Leak check on chamber: result; action; tool re-qualified by check.
{腔體} 洩漏檢查:{結果};{動作};以 {確認} 重新認證機台。
Leak check on E2 chamber B: 5E-8 mbar·L/s detected at lower flange; replaced O-ring and re-tested at 1E-9 mbar·L/s; tool re-qualified by 25-wafer particle monitor.
Leak check on TF-04 chamber A: no leak detected; chamber sealed and pumped down; tool re-qualified by 5-wafer thickness monitor.
vendor escalation
Escalating to vendor on tool_id: symptom since date; in-house attempts: attempts; ETA on-site: eta.
Escalating to vendor on LITHO-07: chuck thermal drift since 03/10; in-house attempts: encoder realignment, controller reset, both ineffective; ETA on-site: 03/14 afternoon.
Escalating to vendor on E2: intermittent RF mismatch since 02/28; in-house attempts: capacitor tuning, impedance re-cal, both ineffective; ETA on-site: 03/01 morning.
— 真實場景 · Real Scenarios · 共 3 條 —
Email — Unscheduled Tool Down
EE 半夜 03:30 發 broadcast email,scanner 突發故障。
Subject: [HOT] LITHO-07 unscheduled down — chuck encoder failure
All,
Heads up — LITHO-07 went down at 03:15 with chuck encoder alarm.
Symptom: Encoder reads jumping ±2° on the chuck rotation axis. Mechanical inspection on site shows worn bearing in the encoder housing.
Plan:
- Encoder swap in progress; expected complete at 06:00.
- Re-cal and qualification with 5 monitor wafers: 06:00 — 09:00.
- Production resume target: 09:00.
WIP impact:
- 8 critical lots queued; 5 rerouted to LITHO-09 and -11. Remaining 3 on hold for LITHO-07 (recipe-specific).
- Product X M2 layer delayed by ~6 hours.
- No customer impact (no hot lots in queue).
Will send recovery update at 06:00 and at qual completion.
Thanks,
EE on call
相關縮寫:scanner · qualification · WIP · PM
Conf Call — Weekly OEE Review
EE 主管月度 OEE review,fab 經理在場。
Thanks everyone. Quick walk through this week's OEE.
Overall: 84.5%, slightly below the 85% target. Three modules drove the gap.
Litho cluster: 76% OEE, target 85%. Three unscheduled CMs this week — two on LITHO-07 (chuck encoder), one on LITHO-09 (RF amp). Total downtime 32 hours. Chuck encoder failure on LITHO-07 is the headline — root cause was a bearing wear pattern; we're tightening the PM interval from 12 months to 9 months, and adding a vibration sensor for early warning.
Etch: 88% OEE, target 85%. Above target; good week. One CM on E2 chamber B for a gas line leak, recovered in 3 hours.
CMP: 82% OEE, target 85%. Slipped due to pad-related issues — we ran two pad swaps this week, one outside the scheduled PM window. Pad lifetime is trending shorter on the M2 Cu recipe; coordinating with PIE on whether to tune the recipe or change pad vendor.
MTBF and MTTR:
- MTBF this week: 145 hours (target 160). Driven down by litho CMs.
- MTTR this week: 4.1 hours (target 4.0). On par.
Action items:
- Litho PM interval tightening — close ECN by next Friday.
- CMP pad vendor evaluation — start a side-by-side trial in 2 weeks.
- Etch keep monitoring chamber B post-leak — confirmation lot tonight.
Questions?
相關縮寫:OEE · PM · CM · MTBF · MTTR · ECN · PIE
Deviation Report — Vacuum Leak on E2 Chamber B
蝕刻機台真空洩漏事故 deviation report Section 4 根因分析。
4.0 Root Cause — Vacuum Leak on E2 Chamber B
4.1 Symptom
Chamber B on E2 (M2 RIE) failed base pressure check on 03/10 morning startup. Base pressure rose to 5E-5 Torr vs the 1E-6 Torr spec within 30 minutes. Eight wafers from the prior production window held pending leak isolation.
4.2 Investigation Path
- Helium leak check identified leak at the lower flange of chamber B (5E-8 mbar·L/s).
- Visual inspection: O-ring at lower flange showed compression set; rubber hardness > spec.
- Maintenance log: O-ring last replaced 14 months ago; recommended service interval is 12 months.
4.3 Root Cause Statement
The vacuum leak is attributed to aged O-ring (compression set + hardness exceeding service spec) at the lower flange of E2 chamber B, exceeding the 12-month replacement interval, confirmed by physical inspection and post-replacement leak rate validation.
4.4 Containment
- E2 chamber B held; O-ring replaced; chamber pumped down and validated at 1E-9 mbar·L/s helium leak rate.
- 8 affected wafers held at next post-etch metrology.
- Chamber re-qualified with 5 monitor wafers; particle adder count and ER both within spec.
4.5 Long-Term Action
- O-ring replacement interval tightened from 12 months to 9 months for chambers running corrosive gases.
- O-ring stock inventory increased to support quarterly replacement scheduling.
- FMEA updated to include "O-ring age beyond service life" as a high-severity vacuum failure mode.