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Daily Abbreviations

每天會用到的縮寫
共 30 個字
— 縮寫表 · 共 30 個字 —
WATWafer Acceptance Test
念整個字「what」(不要拆字母念)· /wɒt/
晶圓出片前的電性驗收測試,確認製程結果是否落在規格內。
WAT data shows the breakdown voltage is 0.3V below spec on lot Q3-218.
SPCStatistical Process Control
字母分開念:S-P-C· /ɛs piː siː/
統計製程管制 — 用控制圖追蹤製程是否穩定。所有部門共通語言。
We need to add this parameter to the SPC chart so we catch the drift earlier.
CpkProcess Capability Index
字母分開念:C-P-K· /siː piː keɪ/
製程能力指數,> 1.33 通常算 capable。報告必出現的指標。
Cpk dropped from 1.5 to 1.1 — recommend a recipe re-cal.
CpProcess Capability
字母分開念:C-P· /siː piː/
製程能力(只看分散度,不管置中)。Cpk 的姊妹指標。
Cp is fine but Cpk is bad — the process is centered off target.
OOCOut Of Control
一個字母一個字母念:O-O-C(千萬不要念成一個字)· /oʊ oʊ siː/
SPC 圖觸發控制線(統計失控)— 還沒超出規格,但統計上不穩定。
The wafer is OOC on CD but still within spec — flagging for engineering review.
OOSOut Of Spec
一個字母一個字母念:O-O-S· /oʊ oʊ ɛs/
超出規格 — 比 OOC 嚴重,通常需要 hold lot、開 CAR、寫 deviation。
Lot is OOS on threshold voltage. Holding pending FA review.
UCL / LCLUpper / Lower Control Limit
字母分開念:U-C-L、L-C-L
控制圖的上下控制線 — 不是規格線,是統計線(通常 ±3σ)。
The data point fell above the UCL but is still within the upper spec limit.
USL / LSLUpper / Lower Spec Limit
字母分開念:U-S-L、L-S-L
上下規格線 — 客戶或內部定的硬規格。超出 = OOS。
USL is 2.4V; we measured 2.45V on five wafers.
DPM / DPPMDefects Per Million / Defective Parts Per Million
字母分開念:D-P-M(或 D-P-P-M)
百萬中的不良數。DPPM 用於組裝/封測終測,DPM 通用。
Customer is reporting DPPM of 32 — well above our target of 10.
CDCritical Dimension
字母分開念:C-D· /siː diː/
關鍵尺寸(通常指線寬)— 黃光、蝕刻部門最常聽到。
CD uniformity dropped after the chamber cleaning — investigating.
PCMProcess Control Monitor
字母分開念:P-C-M
製程監控 — 在晶圓上預設的測試結構,用來抓製程問題。
PCM shift on Vt suggests an implant dose issue.
FAFailure Analysis
字母分開念:F-A
失效分析 — 拿失敗品做電性、物性、化學等分析找根因。
We're sending the failing units to FA to confirm the root cause.
RCARoot Cause Analysis
字母分開念:R-C-A
根因分析。FA 是手段,RCA 是目標。
RCA pointed to a contamination in the wet bench cleaning step.
FMEAFailure Mode and Effects Analysis
念整個字「F-mee-uh」(不是拆四個字母念)· /ˈɛf miːə/
失效模式與效應分析 — 做新製程或改機台時必做的風險評估。
We need to update the FMEA before introducing the new wet etch.
8DEight Disciplines (problem-solving methodology)
念「eight-D」(數字 + 字母)
8 步驟問題解決法 — 客訴回覆、批退處理的標準格式。
Customer is requesting an 8D report by end of week.
CARCorrective Action Request
字母分開念:C-A-R(不要念成「car / 汽車」那個字)
矯正措施要求 — 內部或客戶開,要求對方寫 8D / RCA 並改善。
We received a CAR from our memory module customer last Friday.
SCARSupplier Corrective Action Request
念整個字「scar」(就是疤痕那個英文字)· /skɑːr/
對供應商的 CAR — 我方往上游發。
Issue SCAR #2026-008 to the gas supplier — Ar purity is out of spec.
NCRNon-Conformance Report
字母分開念:N-C-R
不符合報告 — 內部品管系統紀錄不符合事件的單據。
Open an NCR for this lot and put it on hold while we investigate.
ECNEngineering Change Notice
字母分開念:E-C-N
工程變更通知 — 製程或設計改了之後通知相關部門的單據。
ECN-2026-114 covers the new photoresist supplier qualification.
ECOEngineering Change Order
字母分開念:E-C-O
工程變更命令 — 比 ECN 更正式,通常涉及客戶端版本。
The ECO is pending customer approval before we can ramp.
RMAReturn Material Authorization
字母分開念:R-M-A
退貨授權 — 客戶要退失效品給你做 FA 時的憑證。
We've issued an RMA number for the failing modules from line 3.
DOEDesign of Experiments
字母分開念:D-O-E(口語也常念成「dough」,跟麵糰同音)
實驗設計 — 系統化跑製程實驗找最佳參數。Yield 工程師日常。
We ran a DOE on temperature × pressure × time to optimize the etch profile.
HTOLHigh Temperature Operating Life
念「H-tall」(H 加上 tall)或字母分開念 H-T-O-L,兩種都可以
高溫工作壽命試驗 — 可靠度測試的金標,通常 1000hr @ 125°C。
The new package needs to pass HTOL before we can release it for production.
ELTEarly Life Test
字母分開念:E-L-T
早期壽命測試 — 短時間高應力篩選掉嬰兒期失效。
ELT caught two latent defects we would've shipped otherwise.
ESDElectrostatic Discharge
字母分開念:E-S-D
靜電放電 — 操作不當會擊穿元件;ESD 不良是常見的失效模式。
FA confirmed it's ESD damage — operator missed wrist strap check.
QualQualification (product, process, or supplier)
念「kwol」(quality 的縮短,前半段那個音,不是 K-U-A-L)· /kwɑːl/
資格認證 — 例如新製程要做 Qual 才能量產;新供應商要 Qual 才能採購。
We're targeting Qual sign-off by end of Q3.
ATEAutomatic Test Equipment
字母分開念:A-T-E
自動測試機 — Probe / Final Test 站使用的測試平台(Advantest、Teradyne 等)。
ATE downtime in the morning shift cost us 800 wafers.
BINBin (test sort category)
念整個字「bin」(就是「箱子、桶子」那個英文字)· /bɪn/
分箱 — Probe/FT 把測試結果分類的編號。Bin 1 通常是 good die。
Why are we seeing 8% in Bin 7 this week? It's usually under 2%.
KGDKnown Good Die
字母分開念:K-G-D
已知好顆粒 — 給下一站(封裝/MCM/堆疊)用的合格 die。
We need 100% KGD screening before this lot ships to assembly.
CTCycle Time
字母分開念:C-T
週期時間 — 一片 wafer / 一個 lot 從投入到產出花的時間。
CT is creeping up — we're at 38 days average versus the 32-day target.
動詞搭配 · Verb Collocations · 共 10 條 —
yield drops to N%yield + drops to / falls to / dips to

良率掉到 N%(被動下滑)。drop 是最常用的動詞,fall 較正式,dip 暗示短期。

  • Yield dropped to 78% on lot Q3-218 — escalating now.
  • We saw the yield dip to 85% over the weekend, recovered Monday.
yield improves by N%yield + improves by / climbs / recovers

良率上升 N%。improve 中性、climb 暗示緩步上升、recover 則是「掉下去之後拉回來」。

  • Yield improved by 3% after the recipe re-cal.
  • Yield recovered to baseline within two days.
yield is impacted by [factor]yield + is impacted by / is hit by / is sensitive to

良率被 [因子] 影響。is impacted by 中性,is hit by 暗示嚴重,is sensitive to 強調容易飄。

  • Final yield is impacted by overlay drift on M3.
  • This product is highly sensitive to chamber temperature.
defect manifests as [symptom]defect + manifests as / shows up as / appears as

缺陷以 [症狀] 顯現。manifest 學術正式,shows up 口語,appears 中性。寫 deviation report 多用 manifest。

  • The defect manifests as a ring pattern at the wafer edge.
  • It shows up as bin 7 fail at FT but not at CP.
recipe is re-cal'd / locked / tweakedrecipe + re-cal'd / locked / tweaked / drifted

配方被重新校正 / 鎖定 / 微調 / 飄移。re-cal'd = recalibrated,口語縮寫,正式報告寫 recalibrated。

  • The recipe was re-cal'd this morning, monitor for 48 hours.
  • Recipe is locked — no changes without ECN.
Cpk degrades / drops below thresholdCpk + degrades / drops / improves / climbs

Cpk 劣化或跌破門檻(通常 1.33)。degrades 比 drops 更暗示「逐步」變差。

  • Cpk degraded from 1.5 to 1.18 over four weeks.
  • Cpk dropped below the 1.33 threshold — initiating containment.
limits are tightened / loosenedlimits / spec + are tightened / loosened / revisited

規格上下限被收緊 / 放寬 / 重新檢視。客戶要求規格越收越緊是常態。

  • Customer asked us to tighten the breakdown voltage limits.
  • We loosened the upper limit by 5% after process re-qual.
excursion is contained / escalated / closedexcursion + is contained / escalated / closed / opened

異常被遏止 / 升級 / 結案 / 開立。Containment 是 PQA 的關鍵動作 — 防止已知不良流到下一站或客戶。

  • The excursion is contained at WAT — nothing shipped.
  • Escalating this excursion to senior management; customer impact possible.
root cause is identified / pending / suspectedroot cause + is identified / pending / suspected / confirmed

根因已確認 / 待釐清 / 懷疑中 / 確認。8D step 4 的核心動詞。

  • Root cause is identified as a clogged slurry filter.
  • Root cause is pending — preliminary suspect is the new lot of pad.
lot is held / released / scrappedlot + is held / released / scrapped / re-routed

lot 被卡住 / 放行 / 報廢 / 改流程。

  • The lot is held pending FA confirmation.
  • Released the lot after PQA review — no customer impact.
句型 · Sentence Patterns · 共 6 條 —

deviation report · 觀察

We observed symptom on lot lot_id starting at the step step.

我們在 {批號} 從 {製程站} 開始觀察到 {症狀}。Deviation report 第一段最常用的開場句。

  • We observed an edge ring particle pattern on lot Q3-218 starting at the M2 photo step.
  • We observed Vt shift of +50 mV on lot 1842 starting at the well implant step.

8D · root cause statement

The issue is attributed to root_cause, based on evidence.

{問題} 歸因於 {根因},依據是 {證據}。是 8D step 4(D4 — Identify Root Cause)的標準寫法。

  • The CD shift is attributed to a chamber pressure drift, based on the SPC trend and DOE results.
  • The yield drop is attributed to a clogged slurry filter, based on the FA cross-section.

8D · D3 + D5

Containment action: immediate_step. Long-term action: permanent_fix.

暫時 containment 動作:{立即步驟}。長期改善:{永久修正}。8D D3 + D5 的合併寫法。

  • Containment action: hold all lots from chamber A. Long-term action: install in-line pressure monitoring with alarm.
  • Containment action: 100% inspection on all WIP. Long-term action: redesign the slurry delivery system.

yield review · opening

Yield came in N% below the running average on this product / lot.

本批 / 本產品的良率比 running average 低 {N}%。Yield review 開場常用。

  • Yield came in 4% below the running average on the 28nm SoC product.
  • Yield came in 8% below baseline on lot Q3-218 — investigating now.

PQA disposition recommendation

Recommend action pending investigation.

建議 {動作},等待 {調查} 結果。PQA 對 lot disposition 的標準推薦句。

  • Recommend hold pending FA cross-section confirmation.
  • Recommend release pending acceptance of the deviation by the customer.

customer escalation · impact assessment

Customer impact assessment: assessment. N units already shipped / under containment.

客戶衝擊評估:{評估}。已出貨 / 已遏止 {N} 顆。客訴 / spill 處理用。

  • Customer impact assessment: pending FA. 1,200 units shipped, none returned yet.
  • Customer impact assessment: low risk. 0 units shipped — all under containment.
真實場景 · Real Scenarios · 共 3 條 —

Email — Yield Drop Escalation

PQA 主管在週一早上發給 fab manager 與工程主管的 email,周末良率掉了。

Subject: [Action Needed] Yield drop on Product X — week 12

Hi all,

Quick update on the yield situation that emerged over the weekend.

Yield came in 6% below the running average on Product X starting Friday night. Affected scope: 4 lots (Q3-201 ~ Q3-204), all currently held at the WAT step.

Preliminary indication is a chamber pressure excursion on Etch tool 07. Equipment team is on it; I'll have a confirmed root cause by end of day.

Containment action: lots held; no shipments at risk.

Will share the 8D draft once root cause is confirmed.

Thanks,
[Name]

相關縮寫:yield · WAT · excursion · 8D

Conf Call — Yield Review Opening (1 minute)

週四下午 yield review 會議,PQA 開場 1 分鐘把現況講清楚。

Thanks everyone for joining. Quick recap before we dive into the deeper data.

Three things on the table this week:

First, yield on Product X came in 4% below the running average. Root cause is identified as a chamber drift on Etch tool 07; recipe was re-cal'd Tuesday, monitoring now.

Second, Cpk on the breakdown voltage parameter has degraded from 1.5 to 1.2 over the last four weeks. Not yet OOS, but trending. PIE is investigating whether this is implant or anneal.

Third, customer Y is asking us to tighten the upper spec limit by 5%. Initial assessment is feasible but will require process re-qual; full impact assessment by next Friday.

OK, let's go to the data.

相關縮寫:yield · Cpk · OOS · PIE · re-qual

Deviation Report — Section 4 (Root Cause)

正式 deviation report 中「Root Cause Analysis」段落的標準寫法。

4.0 Root Cause Analysis

4.1 Symptom
We observed an edge-ring particle pattern (15-30 particles per wafer, ≥0.3 µm) on lot Q3-218 starting at the M2 photo step.

4.2 Investigation Path
- Chamber correlation: pattern correlates strongly with Etch tool 07 chamber B (Pearson r = 0.91, n = 24).
- Pareto: top contributor is post-clean residue (62% of incidents), followed by gas-line micro-leak (28%).
- Cross-section FA on a fail unit confirmed polymer residue at the bottom of the via.

4.3 Root Cause Statement
The defect is attributed to incomplete chamber clean cycle on tool 07-B following the 03/12 PM, based on the SPC trend, chamber correlation, and FA cross-section evidence.

4.4 Containment
- All lots from tool 07-B held at FT (24 lots, ~600 wafers).
- 100% defect inspection on WIP.
- Tool 07-B taken offline for deep clean; re-released after qualification on 03/19.

相關縮寫:pareto · FA · SPC · PM · FT · WIP · qualification

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