— 縮寫表 · 共 30 個字 —
WATWafer Acceptance Test
念整個字「what」(不要拆字母念)· /wɒt/
晶圓出片前的電性驗收測試,確認製程結果是否落在規格內。
“WAT data shows the breakdown voltage is 0.3V below spec on lot Q3-218.
SPCStatistical Process Control
字母分開念:S-P-C· /ɛs piː siː/
統計製程管制 — 用控制圖追蹤製程是否穩定。所有部門共通語言。
“We need to add this parameter to the SPC chart so we catch the drift earlier.
CpkProcess Capability Index
字母分開念:C-P-K· /siː piː keɪ/
製程能力指數,> 1.33 通常算 capable。報告必出現的指標。
“Cpk dropped from 1.5 to 1.1 — recommend a recipe re-cal.
CpProcess Capability
字母分開念:C-P· /siː piː/
製程能力(只看分散度,不管置中)。Cpk 的姊妹指標。
“Cp is fine but Cpk is bad — the process is centered off target.
OOCOut Of Control
一個字母一個字母念:O-O-C(千萬不要念成一個字)· /oʊ oʊ siː/
SPC 圖觸發控制線(統計失控)— 還沒超出規格,但統計上不穩定。
“The wafer is OOC on CD but still within spec — flagging for engineering review.
OOSOut Of Spec
一個字母一個字母念:O-O-S· /oʊ oʊ ɛs/
超出規格 — 比 OOC 嚴重,通常需要 hold lot、開 CAR、寫 deviation。
“Lot is OOS on threshold voltage. Holding pending FA review.
UCL / LCLUpper / Lower Control Limit
字母分開念:U-C-L、L-C-L
控制圖的上下控制線 — 不是規格線,是統計線(通常 ±3σ)。
“The data point fell above the UCL but is still within the upper spec limit.
USL / LSLUpper / Lower Spec Limit
字母分開念:U-S-L、L-S-L
上下規格線 — 客戶或內部定的硬規格。超出 = OOS。
“USL is 2.4V; we measured 2.45V on five wafers.
DPM / DPPMDefects Per Million / Defective Parts Per Million
字母分開念:D-P-M(或 D-P-P-M)
百萬中的不良數。DPPM 用於組裝/封測終測,DPM 通用。
“Customer is reporting DPPM of 32 — well above our target of 10.
CDCritical Dimension
字母分開念:C-D· /siː diː/
關鍵尺寸(通常指線寬)— 黃光、蝕刻部門最常聽到。
“CD uniformity dropped after the chamber cleaning — investigating.
PCMProcess Control Monitor
字母分開念:P-C-M
製程監控 — 在晶圓上預設的測試結構,用來抓製程問題。
“PCM shift on Vt suggests an implant dose issue.
FAFailure Analysis
字母分開念:F-A
失效分析 — 拿失敗品做電性、物性、化學等分析找根因。
“We're sending the failing units to FA to confirm the root cause.
RCARoot Cause Analysis
字母分開念:R-C-A
根因分析。FA 是手段,RCA 是目標。
“RCA pointed to a contamination in the wet bench cleaning step.
FMEAFailure Mode and Effects Analysis
念整個字「F-mee-uh」(不是拆四個字母念)· /ˈɛf miːə/
失效模式與效應分析 — 做新製程或改機台時必做的風險評估。
“We need to update the FMEA before introducing the new wet etch.
8DEight Disciplines (problem-solving methodology)
念「eight-D」(數字 + 字母)
8 步驟問題解決法 — 客訴回覆、批退處理的標準格式。
“Customer is requesting an 8D report by end of week.
CARCorrective Action Request
字母分開念:C-A-R(不要念成「car / 汽車」那個字)
矯正措施要求 — 內部或客戶開,要求對方寫 8D / RCA 並改善。
“We received a CAR from our memory module customer last Friday.
SCARSupplier Corrective Action Request
念整個字「scar」(就是疤痕那個英文字)· /skɑːr/
對供應商的 CAR — 我方往上游發。
“Issue SCAR #2026-008 to the gas supplier — Ar purity is out of spec.
NCRNon-Conformance Report
字母分開念:N-C-R
不符合報告 — 內部品管系統紀錄不符合事件的單據。
“Open an NCR for this lot and put it on hold while we investigate.
ECNEngineering Change Notice
字母分開念:E-C-N
工程變更通知 — 製程或設計改了之後通知相關部門的單據。
“ECN-2026-114 covers the new photoresist supplier qualification.
ECOEngineering Change Order
字母分開念:E-C-O
工程變更命令 — 比 ECN 更正式,通常涉及客戶端版本。
“The ECO is pending customer approval before we can ramp.
RMAReturn Material Authorization
字母分開念:R-M-A
退貨授權 — 客戶要退失效品給你做 FA 時的憑證。
“We've issued an RMA number for the failing modules from line 3.
DOEDesign of Experiments
字母分開念:D-O-E(口語也常念成「dough」,跟麵糰同音)
實驗設計 — 系統化跑製程實驗找最佳參數。Yield 工程師日常。
“We ran a DOE on temperature × pressure × time to optimize the etch profile.
HTOLHigh Temperature Operating Life
念「H-tall」(H 加上 tall)或字母分開念 H-T-O-L,兩種都可以
高溫工作壽命試驗 — 可靠度測試的金標,通常 1000hr @ 125°C。
“The new package needs to pass HTOL before we can release it for production.
ELTEarly Life Test
字母分開念:E-L-T
早期壽命測試 — 短時間高應力篩選掉嬰兒期失效。
“ELT caught two latent defects we would've shipped otherwise.
ESDElectrostatic Discharge
字母分開念:E-S-D
靜電放電 — 操作不當會擊穿元件;ESD 不良是常見的失效模式。
“FA confirmed it's ESD damage — operator missed wrist strap check.
QualQualification (product, process, or supplier)
念「kwol」(quality 的縮短,前半段那個音,不是 K-U-A-L)· /kwɑːl/
資格認證 — 例如新製程要做 Qual 才能量產;新供應商要 Qual 才能採購。
“We're targeting Qual sign-off by end of Q3.
ATEAutomatic Test Equipment
字母分開念:A-T-E
自動測試機 — Probe / Final Test 站使用的測試平台(Advantest、Teradyne 等)。
“ATE downtime in the morning shift cost us 800 wafers.
BINBin (test sort category)
念整個字「bin」(就是「箱子、桶子」那個英文字)· /bɪn/
分箱 — Probe/FT 把測試結果分類的編號。Bin 1 通常是 good die。
“Why are we seeing 8% in Bin 7 this week? It's usually under 2%.
KGDKnown Good Die
字母分開念:K-G-D
已知好顆粒 — 給下一站(封裝/MCM/堆疊)用的合格 die。
“We need 100% KGD screening before this lot ships to assembly.
CTCycle Time
字母分開念:C-T
週期時間 — 一片 wafer / 一個 lot 從投入到產出花的時間。
“CT is creeping up — we're at 38 days average versus the 32-day target.