Containment action: hold all lots from chamber A. Long-term action: install in-line pressure monitoring with alarm.
Containment action: 100% inspection on all WIP. Long-term action: redesign the slurry delivery system.
yield review · opening
Yield came in N% below the running average on this product / lot.
本批 / 本產品的良率比 running average 低 {N}%。Yield review 開場常用。
Yield came in 4% below the running average on the 28nm SoC product.
Yield came in 8% below baseline on lot Q3-218 — investigating now.
PQA disposition recommendation
Recommend action pending investigation.
建議 {動作},等待 {調查} 結果。PQA 對 lot disposition 的標準推薦句。
Recommend hold pending FA cross-section confirmation.
Recommend release pending acceptance of the deviation by the customer.
customer escalation · impact assessment
Customer impact assessment: assessment. N units already shipped / under containment.
客戶衝擊評估:{評估}。已出貨 / 已遏止 {N} 顆。客訴 / spill 處理用。
Customer impact assessment: pending FA. 1,200 units shipped, none returned yet.
Customer impact assessment: low risk. 0 units shipped — all under containment.
— 真實場景 · Real Scenarios · 共 3 條 —
Email — Yield Drop Escalation
PQA 主管在週一早上發給 fab manager 與工程主管的 email,周末良率掉了。
Subject: [Action Needed] Yield drop on Product X — week 12
Hi all,
Quick update on the yield situation that emerged over the weekend.
Yield came in 6% below the running average on Product X starting Friday night. Affected scope: 4 lots (Q3-201 ~ Q3-204), all currently held at the WAT step.
Preliminary indication is a chamber pressure excursion on Etch tool 07. Equipment team is on it; I'll have a confirmed root cause by end of day.
Containment action: lots held; no shipments at risk.
Will share the 8D draft once root cause is confirmed.
Thanks,
[Name]
相關縮寫:yield · WAT · excursion · 8D
Conf Call — Yield Review Opening (1 minute)
週四下午 yield review 會議,PQA 開場 1 分鐘把現況講清楚。
Thanks everyone for joining. Quick recap before we dive into the deeper data.
Three things on the table this week:
First, yield on Product X came in 4% below the running average. Root cause is identified as a chamber drift on Etch tool 07; recipe was re-cal'd Tuesday, monitoring now.
Second, Cpk on the breakdown voltage parameter has degraded from 1.5 to 1.2 over the last four weeks. Not yet OOS, but trending. PIE is investigating whether this is implant or anneal.
Third, customer Y is asking us to tighten the upper spec limit by 5%. Initial assessment is feasible but will require process re-qual; full impact assessment by next Friday.
OK, let's go to the data.
相關縮寫:yield · Cpk · OOS · PIE · re-qual
Deviation Report — Section 4 (Root Cause)
正式 deviation report 中「Root Cause Analysis」段落的標準寫法。
4.0 Root Cause Analysis
4.1 Symptom
We observed an edge-ring particle pattern (15-30 particles per wafer, ≥0.3 µm) on lot Q3-218 starting at the M2 photo step.
4.2 Investigation Path
- Chamber correlation: pattern correlates strongly with Etch tool 07 chamber B (Pearson r = 0.91, n = 24).
- Pareto: top contributor is post-clean residue (62% of incidents), followed by gas-line micro-leak (28%).
- Cross-section FA on a fail unit confirmed polymer residue at the bottom of the via.
4.3 Root Cause Statement
The defect is attributed to incomplete chamber clean cycle on tool 07-B following the 03/12 PM, based on the SPC trend, chamber correlation, and FA cross-section evidence.
4.4 Containment
- All lots from tool 07-B held at FT (24 lots, ~600 wafers).
- 100% defect inspection on WIP.
- Tool 07-B taken offline for deep clean; re-released after qualification on 03/19.
相關縮寫:pareto · FA · SPC · PM · FT · WIP · qualification