ECN 2026-114 covers etcher chamber B qualification post-rebuild; impact: all etch layers on Product X; sign-off needed by Etch lead.
ECN 2026-203 covers new resist supplier qualification; impact: all critical photo layers; sign-off needed by Photo + PIE.
design rule check · PIE
DR check fail on feature: rule_violated; mitigation: fix (cost: N days, N masks).
{特徵} 上的 DR check 失敗:違反 {規則};緩解:{修法}(成本:{N} 天,{N} 道光罩)。
DR check fail on M5 line: spacing 75 nm vs 80 nm rule; mitigation: relax M5 spacing to 78 nm (cost: 5 days, 0 masks).
DR check fail on contact: density 40% vs 35% rule; mitigation: add dummy contact fill (cost: 2 days, 0 masks).
PIE disposition
Per PIE: action on scope; basis: evidence; effective date.
依 PIE 判定:對 {範圍} 採取 {動作};基於 {證據};生效 {日期}。
Per PIE: hold M2 photo on LITHO-07; basis: overlay excursion correlated with chamber B; effective immediately.
Per PIE: release lots Q3-218 ~ Q3-221; basis: WAT and PCM data within spec post-investigation; effective tonight.
— 真實場景 · Real Scenarios · 共 3 條 —
Email — Tape-out Status Update
PIE 主管週五發給 R&D 跟 product team 的 tape-out 進度更新。
Subject: [STATUS] Product X 7nm tape-out — week 12 update
Hi all,
Quick recap of tape-out status this week:
Current target: Q3 end.
Critical path items:
1. M5 layer DR fix-ups — DRC clean, layout team finalizing this weekend. Closes by Monday.
2. BEOL stack revision E — ECN signed off Wednesday. POR updated in MES.
3. New low-k dielectric qualification — RR pending; thin film team running monitor wafers through next Tuesday.
Risks:
- M5 metal CMP recipe still showing dishing 35 nm vs 30 nm target. CMP team is tuning the downforce; one more iteration this week.
- EUV reticle delivery for the contact layer slipped 4 days due to mask shop yield. Recovery plan in place; doesn't impact tape-out date if BEOL closes by Monday.
Will share final go/no-go decision in the staff meeting Thursday.
Thanks,
PIE
相關縮寫:tape-out · DR · ECN · POR · RR · BKM
Conf Call — Yield Pareto Review
Yield review,PIE 主持,展示週度 Pareto 並點名各部門。
Thanks everyone. Let's go through this week's yield pareto.
We came in at 86.5% on Product X, 4.5% below the running average of 91%. Three modules account for ~80% of the loss.
First contributor — 62% of the loss — is the M2 photo overlay excursion on LITHO-07. Litho team has the root cause (chuck thermal drift); recipe re-cal'd Tuesday. Need a confirmation lot before Friday to clear the SPC alarm.
Second — 18% of the loss — is CD bias drift on the M3 etch step, chamber A. Etch team confirmed the chamber A impedance match drift; corrected after PM. Monitor SPC for the next 48 hours.
Third — small contributor, 5% — is post-CMP residue on the M2 metal layer. Cleaner megasonic power dropped after a flow controller drift; CMP corrected it last shift.
Action items:
- Litho confirmation lot by Friday EOD.
- Etch SPC update by Monday morning.
- CMP cleaner stability monitored for the next 2 days.
Re-pareto next week to validate the recovery.
OK, going to detailed data — Litho team, you're up.
相關縮寫:pareto · overlay · CD · SPC · PM
ECN Summary — New Etcher Chamber Qualification
PIE 推給變更管理委員會的 ECN summary,新蝕刻 chamber 認證。
ECN 2026-114 — Qualify Etch Chamber B Post-Rebuild
Change Summary
- Scope: Etch tool E2 chamber B post electrode rebuild on 03/01.
- Affected layers: M2 trench, M3 contact, V3 via.
- Recipe versions: E2-M2-RIE v3.2, E2-M3-CT v2.5, E2-V3-VIA v1.8 (unchanged; recipe-as-is qualification).
Justification
Chamber B was offline for 6 weeks for electrode rebuild after the impedance match failure on 01/15. Following rebuild, the chamber must be re-qualified before returning to production.
Qualification Plan
- 10 monitor wafers per recipe across the 3 affected layers (30 wafers total).
- KPIs: CD bias within ±1 nm of chamber A baseline; profile angle 89° ±1°; particle adder count < 10; EPD signal-to-noise > 5.
- Sign-off: Etch lead (technical), PIE (integration), PQA (production release).
Risk Assessment
Low. Recipes unchanged; mechanical rebuild only. Chamber matching to chamber A is the main risk; mitigated by 100% monitor wafer screening for the first 2 weeks of production.
Schedule
- Qualification wafers run: 03/15 ~ 03/18.
- Data review: 03/19.
- Production release: 03/20 (assuming all KPIs hit).
Sign-off needed by: Etch lead, PIE, PQA (this ECN).