Excursion alarmed on defect density at 03:14; lot Q3-218 held within 30 minutes.
Excursion alarmed on CD bias at 14:22; lot 1842 held within 15 minutes.
yield review opening
Yield came in N% below the running average on product starting date.
{產品} 的良率從 {日期} 起比 running average 低 {N}%。Yield review 開場句。
Yield came in 4% below the running average on Product X starting Friday.
Yield came in 6% below the running average on the 28-nm SoC starting last weekend.
PQA disposition
Per PQA: hold scope pending check; reroute remaining WIP to alternative.
依 PQA 判定:對 {範圍} 採取 hold,等待 {確認};剩餘 WIP 改流到 {替代}。
Per PQA: hold all M3 lots from LITHO-07 pending overlay re-cal; reroute remaining WIP to LITHO-09 and -11.
Per PQA: hold lots Q3-218 ~ Q3-221 pending FA cross-section; reroute remaining WIP to chamber B.
hot lot escalation
Hot lot lot_id from customer: scheduled step at time; expected ship date.
{客戶} 的急件 {批號}:排定 {站別} 於 {時間};預期 {日期} 出貨。
Hot lot HL-2026-018 from customer Y: scheduled M2 etch at 14:00; expected ship 03/16.
Hot lot HL-2026-022 from customer Z: scheduled CMP at 06:00; expected ship 03/14.
— 真實場景 · Real Scenarios · 共 3 條 —
Email — Morning Production Status
Production manager 每天 08:00 發給全 fab 主管的早報。
Subject: [DAILY] Morning Status — 03/14
All,
Quick morning recap:
WIP status:
- Total WIP: 18,400 wafers (down 200 from yesterday).
- Bottleneck: M3 photo on LITHO-07 (chuck encoder issue ongoing). WIP at this step: 1,400 wafers — 2x normal.
Holds (active):
- Lots Q3-218 ~ Q3-221: held at WAT pending FA confirmation on the N-channel Vt shift.
- Lot 1842: held at M3 CMP pending dishing root cause review.
Hot lots in queue:
- HL-2026-018 from customer Y at M2 etch — scheduled run 14:00.
- HL-2026-022 from customer Z at FT — scheduled 06:00 (cleared).
Today's escalations to track:
- LITHO-07 chuck encoder swap target 06:00 recovery.
- M3 photo overlay excursion — confirmation lot tonight.
- CMP-04 pad replacement scheduled Friday.
Yield this week: 91.2% running average. On target.
Any questions, ping me directly.
Thanks,
Production Manager
相關縮寫:WIP · hot lot · WAT · FA · excursion · yield
Conf Call — Cross-Functional Daily Stand-up
每日 09:00 跨部門 stand-up,各部門 lead 2 分鐘輪流報告,通常 PIE 主持。
OK, daily stand-up. Quick updates from each module — please keep it under 2 minutes.
Photo: LITHO-07 came back online at 06:30 after chuck encoder swap. Qualification passed; first production lot running now. WIP queue clearing well. No new alarms.
Etch: Chamber B leak issue resolved last night. O-ring replaced; chamber re-qualified with 5 monitor wafers. Particle count back to baseline. One pending — lot 1842 needs CD bias confirmation, should close by end of shift.
Thin Film: Routine week. One PM scheduled tomorrow on TF-04 chamber A. No excursions, no holds.
CMP: Pad replacement Friday — already announced. MRR drift on chamber A within tolerance still. CMP-04 dishing recovery confirmed on the post-tune monitor lot.
Implant: RTA non-uniformity on chamber A closed yesterday — quartz window replaced, re-qualified. No active escalations.
PQA: Three active 8Ds in flight — N-channel Vt (implant root cause confirmed), CD shift on M2 photo (litho root cause confirmed), M3 dishing (CMP root cause confirmed). All in containment, none customer-impacting.
PIE: Tape-out target for Product X-7nm still on track for Q3 end. ECN 2026-114 for E2 chamber B re-qual signed off this morning. Pareto for the week will be ready by Thursday.
Equipment: OEE for the week so far 85.8%; three unscheduled CMs (litho, etch, CMP). MTBF flat, MTTR slight uptick driven by litho. Weekly OEE review Thursday.
That's it. Any cross-team blockers?
Defect density 異常的 incident report,fab-wide impact 評估。
Excursion #2026-318 — Defect Density Spike
1.0 Summary
Defect density on M2 metal layer alarmed at 02:14 on 03/14, reaching 0.38 defects/cm² vs SPC UCL of 0.20. Affected scope: 4 lots (Q3-241 through Q3-244), 96 wafers total.
2.0 Symptom
Inline defect inspection shows scratched defects clustered radially on the wafer surface. Defect classification: 85% scratch-type, 12% particle-type, 3% other.
3.0 Initial Investigation
- All 4 lots ran post-CMP cleaning on CMP-04 during a 4-hour window.
- Megasonic power on chamber B dropped from 1500W to 800W during the window — flow controller drift suspected.
- FA on a defect-heavy wafer confirms incomplete slurry removal as the failure mode.
4.0 Containment
- All 96 wafers held at next inspection station.
- CMP-04 chamber B held for megasonic re-cal.
- Defect metrology added to next 20 lots through CMP-04 as enhanced screening.
5.0 Disposition
- Per PQA: hold WIP from chamber B until megasonic re-cal complete and 5 monitor wafers confirm defect density back below UCL.
- Per PIE: no customer impact pending FA close-out; 8D draft due by 03/18.
6.0 Next Update
- 03/15 EOD: megasonic re-cal results.
- 03/16 EOD: monitor wafer disposition.
- 03/18 EOD: 8D close-out + long-term action.